During my internship, I was involved in Boeing Thermal System/M&P, which handles maintenance and repairs of shuttle tiles, blankets, gap fillers, etc. One project I took part in was the revision of TPS-227, a repair process to tiles that entailed drilling out tile damage and using a cylindrical insert to fill the hole. The previous specification used minimal adhesive for application and when the adhesive cured, there would be several voids in the adhered material, causing an unsatisfactory bond. The testing compared several new methods and I analyzed the number of voids produced by each method to determine which one was most effective at eliminating void space. We revised the original process to apply a light adhesive coat to the top 25% of the borehole and a heavy coat to 100% of the insert. I was also responsible for maintaining the subnominal bond database, which records all unsatisfactory SIP (Strain Isolator Pad) bonds. I then archived each SIP physically for future referral data and statistics. In addition, I performed post-flight tile inspections for damages and wrote dispositions to have these tiles repaired. This also included writing a post-flight damage report for a section of Atlantis and creating summarized repair process guidelines for orbiter technicians.